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[Fizinfo] EK MFA szeminárium, John F. Conley, Jr., 2026 szeptember 11, péntek 11.00
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- From: Horváth Zsolt Endre <horvath.zsolt.endre AT ek.hun-ren.hu>
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- Subject: [Fizinfo] EK MFA szeminárium, John F. Conley, Jr., 2026 szeptember 11, péntek 11.00
- Date: Tue, 8 Sep 2026 13:12:14 +0200
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Kedves Kollégák!
** Figyelem, a szokásostól eltérő időpont! **
2026 szeptember 11-én, pénteken 11 órakor kerül sor az EK MFA 26. épület, 1 emeleti tanácstermében
Prof. John F. Conley, Jr.
School of Electrical Engineering and Computer Science,
Oregon State University, Corvallis, OR, USA
"Microwave Enhanced Atomic Layer Processing"
c. előadására.
Összefoglaló:
Atomic layer processing (ALP), based on cyclic purge-separated self-limiting reactions, enables formation of highly uniform and conformal films with atomic scale thickness control. The low deposition temperatures typical of ALP, however, can allow for incorporation of residual impurities which in turn can lead to non-ideal stoichiometry and sub-optimal film properties. Although elevated temperature post-deposition annealing (PDA) can improve film quality, PDA often cannot completely purify the full thickness of a film and the temperatures required can exceed the maximum thermal budget of the substrate or previously formed electronics. To maintain low thermal budget while maximizing film properties, adding annealing or other energy treatments during each (or every few) ALP cycle(s) has been shown to help drive / speed reactions and reduce impurity / ligand incorporation. Collectively referred to as energy enhanced (EE) ALD, these techniques are distinct from plasma ALD. Treatments include in-situ rapid thermal annealing (MTA, DADA), flash lamps, plasma exposure, and UV [1,2]. These in-situ treatments can remove impurities and defects from the surface of the growing film before they become buried, resulting in a more complete densification or purification than PDA. Demonstrated benefits of EE-ALD include improved physical, optical, and electrical properties as well as reduced residual impurities, all at a lower temperature than PDA, and often not achievable by PDA. However, drawbacks of EE-ALD can include added process time, plasma, and/or UV damage. To try and avoid these drawbacks, we introduce microwave enhanced (MW) ALP [3]. Exsitu post MW annealing was originally shown to improve dopant activation at reduced temperature while minimizing diffusion, and more recently to improve properties of fully formed ALD films and devices [4]. Here, I describe the development of a MW-ALD system and INVITED TALK 28 compare MW-ALD of various films with MW-PDA. In-situ MW enhancement may offer the promise of more closely approaching ideal ALD film formation. [1] Conley, Jr. et al., Appl. Phys. Lett. 84, 1913 (2004). [2] Conley, Jr. et al., MRS Proc. Vol. 811, 5 (2004). [3] Kupp, et al. J. Vac. Sci. Tech. A. 43(5), 052403 (2025). [4] Yue et al. IEEE EDL 38,1390 (2017)
Minden érdeklődőt szívesen látunk!
Horváth Zsolt Endre
Szeminárium koordinátor
Dr. Zsolt E. HORVÁTH
Institute for Technical Physics and Materials Science,
Centre for Energy Research
(EK MFA)
Konkoly Thege Rd. 29-33, 1121 Budapest,
Mail: P.O.Box 49, H-1525 Budapest, Hungary
Phone: +36-1-392-2680, Fax: +36-1-392-2226
e-mail:horvath.zsolt.endre AT ek.hun-ren.hu
- [Fizinfo] EK MFA szeminárium, John F. Conley, Jr., 2026 szeptember 11, péntek 11.00, Horváth Zsolt Endre, 09/08/2026
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